Heat dissipation structure for heat dissipation device

ABSTRACT

A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance.

FIELD OF THE INVENTION

The present invention relates to a heat dissipation structure for heatdissipation device, and more particularly to a heat dissipationstructure that enables a working fluid in a heat dissipation device tohave upgraded vapor/liquid cycling efficiency.

BACKGROUND OF THE INVENTION

It is known that various heat transfer components, such as heat pipes,vapor chambers, loop heat pipes and heat exchangers, are currentlywidely employed in electronic apparatuses for transferring anddissipating heat at high efficiency.

Such heat transfer components have excellent heat transfer rate severaltimes to several tens times as high as that of copper, aluminum and thelike, and are therefore used in various electronic apparatuses ascooling components. Regarding heat pipes, they can be divided accordingto their shapes into circular heat pipes, flat heat pipes and D-shapedheat pipes. For cooling an electronic component in an electronicapparatus that produces heat during operation or working, such as a CPUor an executing component, it is preferable to use a vapor chamber, aflat heat pipe or a thin-type heat exchanger as the heat transfer orcooling component in view of the easy installation and large contactarea thereof. Meanwhile, due to the demands for a miniaturized coolingmechanism, heat pipes therefor must also be extremely thin to adapt tothe very limited internal space in the cooling mechanism.

Further, for a working fluid provided in the above-mentioned heattransfer components to cyclically convert between vapor phase and liquidphase, capillary structures with capillary force, such as groovedstructures, metal mesh structures or sintered structures, are alsoprovided in the heat transfer components to help the working fluid tocarry on the vapor/liquid cycling smoothly.

For using in a narrow space, the heat transfer components must bemanufactured to be very thin. However, other than the thickness of theheat transfer component, the capillary structures inside the heattransfer component form another major obstacle in further thinning theheat transfer component.

Moreover, the capillary force of the thinned capillary structures willdegrade to adversely affect the vapor/liquid cycling efficiency of theworking fluid to thereby largely reduce the heat transfer efficiency ofthe heat transfer component. Therefore, the conventional heat transfercomponents have the following disadvantages: (1) poor heat transferefficiency; and (2) unable to be effectively thinned.

SUMMARY OF THE INVENTION

To overcome the above-mentioned drawbacks in the prior art heat transfercomponents, it is a primary object of the present invention to provide aheat dissipation structure for heat dissipation device that enablesupgraded heat transfer and heat dissipation efficiency.

Another object of the present invention is to provide a heat dissipationstructure for heat dissipation device that enables a working fluid in athin-type heat dissipation device to have enhanced vapor/liquid cyclingefficiency.

To achieve the above and other objects, the heat dissipation structurefor heat dissipation device according to the present invention includesa heat dissipation device main body that internally defines a chamber.The chamber is internally provided with at least a whisker layer and aworking fluid, and the whisker layer is continuously provided on aninner wall surface of the chamber.

According to the present invention, the heat dissipation device mainbody can be any one of a heat pipe, a loop heat pipe, a flat heat pipe,a vapor chamber, and a heat exchanger.

The whisker layer is able to largely upgrade the vapor/liquid cyclingefficiency of the working fluid in the heat dissipation device main bodybecause it has a dense structure to maintain a capillary force even in athin-type heat dissipation device, and can therefore help the workingfluid to carry on vapor/liquid cycling smoothly.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present inventionto achieve the above and other objects can be best understood byreferring to the following detailed description of the preferredembodiments and the accompanying drawings, wherein

FIG. 1 is a perspective view of a heat dissipation structure for heatdissipation device according to a first embodiment of the presentinvention;

FIG. 2 is a sectional view taken along line A-A of FIG. 1;

FIG. 2A is an enlarged view of the circled area of FIG. 2;

FIG. 3 is a sectional view of a heat dissipation structure for heatdissipation device according to a second embodiment of the presentinvention;

FIG. 4 is a sectional view of a heat dissipation structure for heatdissipation device according to a third embodiment of the presentinvention;

FIG. 5 is a sectional view of a heat dissipation structure for heatdissipation device according to a fourth embodiment of the presentinvention;

FIG. 6 is a sectional view of a heat dissipation structure for heatdissipation device according to a fifth embodiment of the presentinvention;

FIG. 7 is a sectional view of a heat dissipation structure for heatdissipation device according to a sixth embodiment of the presentinvention;

FIG. 8 is a sectional view of a heat dissipation structure for heatdissipation device according to a seventh embodiment of the presentinvention;

FIG. 9 is a sectional view of a heat dissipation structure for heatdissipation device according to an eighth embodiment of the presentinvention;

FIG. 10 is a sectional view of a heat dissipation structure for heatdissipation device according to a ninth embodiment of the presentinvention; and

FIGS. 10A-10D are SEM images of the whisker layer in the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferredembodiments thereof and with reference to the accompanying drawings. Forthe purpose of easy to understand, elements that are the same in thepreferred embodiments are denoted by the same reference numerals.

Please refer to FIG. 1 that is a perspective view of a heat dissipationstructure for heat dissipation device according to a first embodiment ofthe present invention, and to FIGS. 2 and 2A that are respectively asectional view taken along line A-A of FIG. 1 and an enlarged view ofthe circled area of FIG. 2. As shown, in the first embodiment thereof,the heat dissipation structure for heat dissipation device includes aheat dissipation device main body 1 that internally defines a chamber11, in which at least a whisker layer 111 and a working fluid 112 areprovided. The whisker layer 111 is continuously provided on a whole orpart of the inner wall surface of the chamber 11, and is formed of aplurality of individual whiskers. The individual whiskers respectivelyhave an end fixedly located on the inner wall surface of the chamber 11and referred to as a fixed connecting end herein, and another oppositeend extending toward an interior of the chamber 11 and being a free end.As can be seen from some SEM (scanning electron microscope) images ofthe whisker layer 111 shown in the FIGS. 10A-10D, the individualwhiskers have sharp free ends.

The main body 1 can be any one of a vapor chamber, a flat heat pipe, aloop heat pipe, and a heat exchanger. In the illustrated firstembodiment of the present invention, the main body 1 is a flat heat pipewithout being limited thereto. Further, the chamber 11 has a smoothinner wall surface.

Please refer to FIG. 3 that is a sectional view of a heat dissipationstructure for heat dissipation device according to a second embodimentof the present invention. As shown, in the second embodiment, the heatdissipation device main body 1 is also illustrated as a heat pipe butnot necessarily limited thereto, and the whisker layer 111 axiallyextends along the inner surface of the chamber 11 of the heat pipe.

FIG. 4 is a sectional view of a heat dissipation structure for heatdissipation device according to a third embodiment of the presentinvention. As shown, in the third embodiment, the heat dissipationdevice main body 1 is also illustrated as a heat pipe but notnecessarily limited thereto, and the chamber 11 includes at least afirst section 113, a second section 114 and a third section 115connected to and communicable with one another. The whisker layer 111can be selectively provided in any one of the first, the second and thethird section 113, 114, 115. In the illustrated third embodiment, thewhisker layer 111 is provided only in the second section 114 but notnecessarily restricted thereto.

FIG. 5 is a sectional view of a heat dissipation structure for heatdissipation device according to a fourth embodiment of the presentinvention. As shown, the fourth embodiment is generally structurallysimilar to the third embodiment, except that the chamber 11 in thefourth embodiment is further internally provided with a coating 2, whichhas both super-hydrophilic and super-hydrophobic properties. The coating2 is selectively provided in any one of the first, the second and thethird section 113, 114, 115. In the illustrated fourth embodiment, thecoating 2 is provided in the third section 115.

Please refer to FIG. 6 that is a sectional view of a heat dissipationstructure for heat dissipation device according to a fifth embodiment ofthe present invention. As shown, the fifth embodiment is generallystructurally similar to the third embodiment, except that the chamber 11in the fifth embodiment is further internally provided with a coating 2,and the coating 2 is provided in the first and the third section 113,115 of the chamber 11.

Please refer to FIG. 7 that is a sectional view of a heat dissipationstructure for heat dissipation device according to a sixth embodiment ofthe present invention. As shown, the sixth embodiment is generallystructurally similar to the second embodiment, except that, in the sixthembodiment, a wick structure 3 is further provided between the innerwall surface of the chamber 11 and the whisker layer 111. The wickstructure 3 can be any one of a sintered powder structure, a meshstructure, a fibrous structure, a porous structure, a grooved structure,and any combinations thereof. In the sixth embodiment, the wickstructure is illustrated as a grooved structure without being limitedthereto. The grooved structure includes a plurality of grooves formed onand sunken from the inner wall surface of the chamber 11, and thewhisker layer 111 covers both the grooves and the inner wall surface ofthe chamber 11.

FIG. 8 is a sectional view of a heat dissipation structure for heatdissipation device according to a seventh embodiment of the presentinvention. As shown, the seventh embodiment is generally structurallysimilar to the second embodiment, except that, in the seventhembodiment, a coating 2 is further provided between the inner wallsurface of the chamber 11 and the whisker layer 111.

FIG. 9 is a sectional view of a heat dissipation structure for heatdissipation device according to an eighth embodiment of the presentinvention. As shown, the eighth embodiment is generally structurallysimilar to the third embodiment, except that the chamber 11 in theeighth embodiment further includes at least a first section 113, asecond section 114 and a third section 115 that are connected to andcommunicable with one another, and a portion of the whisker layer 111provided in the second section 114 has a density higher than that ofother portions of the whisker layer 111 provided in the first and thethird section.

FIG. 10 is a sectional view of a heat dissipation structure for heatdissipation device according to a ninth embodiment of the presentinvention. As shown, the ninth embodiment is generally structurallysimilar to the third embodiment, except that the chamber 11 in the ninthembodiment further includes at least a first section 113, a secondsection 114 and a third section 115 that are connected to andcommunicable with one another, and a portion of the whisker layer 111provided in the second section 114 has a density lower than that ofother portions of the whisker layer 111 provided in the first and thethird section.

In brief, by providing the whisker layer 111 in the heat pipe, the vaporchamber, the flat heat pipe and the loop heat pipe, the whisker layer111 is able to change the surface tension of the working fluid 112 inthe chamber 11, so that the working fluid 112 can flow back at anincreased speed to provide excellent vapor/liquid cycling efficiency forthe heat dissipation device to have largely upgraded heat transferperformance.

The FIG. 10A-10D shows some SEM images of the whisker layer 111, whichcan be covered over a wick structure.

The present invention has been described with some preferred embodimentsthereof and it is understood that many changes and modifications in thedescribed embodiments can be carried out without departing from thescope and the spirit of the invention that is intended to be limitedonly by the appended claims.

What is claimed is:
 1. A heat dissipation structure for heat dissipationdevice, comprising a heat dissipation device main body internallydefining a chamber, the chamber being internally provided with at leasta whisker layer and a working fluid, and the whisker layer beingcontinuously provided on an inner wall surface of the chamber.
 2. Theheat dissipation structure for heat dissipation device as claimed inclaim 1, wherein the heat dissipation device main body is a heat pipe,and the chamber includes at least a first, a second and a third section,which are connected to and communicable with one another; and thewhisker layer being provided in one of or each of the first, the second,and the third section.
 3. The heat dissipation structure for heatdissipation device as claimed in claim 1, wherein the inner wall surfaceof the chamber is a smooth wall surface.
 4. The heat dissipationstructure for heat dissipation device as claimed in claim 2, wherein thechamber is further internally provided with a coating, and the coatingbeing selectively provided in any one of the first, the second, and thethird section.
 5. The heat dissipation structure for heat dissipationdevice as claimed in claim 1, wherein the heat dissipation device mainbody is selected from the group consisting of a vapor chamber, a heatpipe, a loop heat pipe, and a heat exchanger.
 6. The heat dissipationstructure for heat dissipation device as claimed in claim 1, wherein thechamber is further internally provided between the inner wall surfaceand the whisker layer with a wick structure.
 7. The heat dissipationstructure for heat dissipation device as claimed in claim 6, wherein thewick structure is selected from the group consisting of a sinteredpowder structure, a mesh structure, a fibrous structure, a porousstructure, and a grooved structure.
 8. The heat dissipation structurefor heat dissipation device as claimed in claim 1, wherein the heatdissipation device main body is a heat pipe, and the whisker layer beingaxially extended over the inner wall surface of the chamber of the heatpipe.
 9. The heat dissipation structure for heat dissipation device asclaimed in claim 2, wherein a portion of the whisker layer provided inthe second section of the chamber has a density higher than that ofother portions of the whisker layer provided in the first and the thirdsection.
 10. The heat dissipation structure for heat dissipation deviceas claimed in claim 2, wherein a portion of the whisker layer providedin the second section of the chamber has a density lower than that ofother portions of the whisker layer provided in the first and the thirdsection.
 11. The heat dissipation structure for heat dissipation deviceas claimed in claim 1, wherein the whisker layer is formed of aplurality of individual whiskers; the individual whiskers respectivelyhaving a fixed connecting end located on the inner wall surface of thechamber and another opposite end extending toward an interior of thechamber to form a free end; and the free ends of the individual whiskersbeing sharp ends.
 12. The heat dissipation structure for heatdissipation device as claimed in claim 2, wherein the whisker layer isformed of a plurality of individual whiskers; the individual whiskersrespectively having a fixed connecting end located on the inner wallsurface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 13. The heat dissipation structurefor heat dissipation device as claimed in claim 3, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 14. The heat dissipation structurefor heat dissipation device as claimed in claim 4, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 15. The heat dissipation structurefor heat dissipation device as claimed in claim 5, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 16. The heat dissipation structurefor heat dissipation device as claimed in claim 6, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 17. The heat dissipation structurefor heat dissipation device as claimed in claim 7, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 18. The heat dissipation structurefor heat dissipation device as claimed in claim 8, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 19. The heat dissipation structurefor heat dissipation device as claimed in claim 9, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.
 20. The heat dissipation structurefor heat dissipation device as claimed in claim 10, wherein the whiskerlayer is formed of a plurality of individual whiskers; the individualwhiskers respectively having a fixed connecting end located on the innerwall surface of the chamber and another opposite end extending toward aninterior of the chamber to form a free end; and the free ends of theindividual whiskers being sharp ends.